NXTwave Semiconductor
Back to careers

Open position

Physical Design (PD) Engineer

Physical DesignFull-time

About the Role

We are looking for a motivated Physical Design (PD) Engineer to join our semiconductor engineering team. The candidate will contribute to physical implementation across IP/block, subsystem, and full-chip/SoC levels, taking designs from synthesized netlists through physical sign-off. The role involves physical implementation, optimization, timing closure, integration of macros and IPs, and analysis of power, performance, area, and physical constraints.

What You'll Do

  • Work across floorplanning, power planning, placement, clock tree synthesis, routing, optimization, and physical sign-off.
  • Implement and optimize blocks, IPs, subsystems, and full-chip/SoC designs.
  • Integrate standard cells, memories, hard macros, analog IPs, IOs, and other physical blocks.
  • Analyze and optimize setup/hold timing, congestion, power, area, and signal integrity.
  • Perform multi-corner/multi-mode analysis and support timing closure.
  • Support clock and power distribution, physical constraints, and hierarchical implementation.
  • Perform ECO implementation and resolve physical and timing issues.
  • Analyze implementation and sign-off reports and drive design closure.
  • Collaborate with RTL, STA, DFT, PV, package, and sign-off teams.

Required Skills

  • Good understanding of the ASIC physical design flow.
  • Knowledge of floorplanning, power planning, placement, CTS, routing, and timing closure.
  • Understanding of setup/hold, clock skew, constraints, parasitics, and PPA.
  • Understanding of block-level and top-level physical integration.
  • Good analytical and debugging skills.

Good to Have

  • Advanced-node implementation and hierarchical SoC implementation.
  • Low-power/UPF, IR drop, EM, signal integrity, and physical sign-off.
  • Integration of HBM, high-speed IO, memories, analog macros, and chiplet-related physical structures.
  • TCL, Python, Perl, or shell scripting.

Educational Qualification

B.E./B.Tech/M.E./M.Tech in Electronics & Communication Engineering, Electrical Engineering, Computer Engineering, VLSI, Microelectronics, or a related field.

What We Look For

  • Strong technical fundamentals and a practical engineering mindset.
  • Ability to understand specifications and solve complex technical problems.
  • Effective debugging, analysis, and communication skills.
  • Ability to work independently and collaboratively across engineering teams.
  • Curiosity and willingness to learn new semiconductor technologies and methodologies.

What You Will Work On

  • IP/Block Implementation
  • Subsystem Implementation
  • Full-Chip/SoC
  • Floorplanning
  • Placement
  • CTS
  • Routing
  • Timing Closure
  • PPA Optimization
  • Advanced Nodes
  • HBM
  • Chiplets

Closing Statement

Implement high-performance, power-efficient and area-conscious semiconductor designs through physical closure and sign-off.